In a recent interview, Lotus Microsystems highlighted how their advanced packaging technology tackles challenges in high-current, low-voltage systems. By bringing components closer to the load, they effectively reduce power losses and IR drops, focusing beyond just power converter design.
Lotus Microsystems has introduced two power modules and a thermal guide to enhance performance. These power modules integrate passive components, like inductors, into a compact design, cutting the footprint by 30-40%. They support applications such as optical modules, telecom, CPUs, and medical devices. The Lotus Thermal Guide, which is thermally conductive and electrically insulated, efficiently redirects heat, reducing the need for heat sinks. It’s particularly useful in power amplifiers and laser diodes.
Looking forward, Lotus plans to expand its product range with custom solutions for advanced applications. The company focuses on developing smaller, more efficient components to lead innovations in power and thermal management. They offer evaluation boards and are actively hiring engineers.
With cutting-edge products and a growing lineup, Lotus Microsystems is set to drive significant advancements in power and thermal management.
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