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Published
9 April 2026
Written by Yunus Unal Mechatronics Engineer and Content Specialist
Yunus is a mechatronics engineer with a background in 5G mobile communications and intelligent embedded systems. Before joining TKO and ipXchange, he developed and tested IoT and control-system prototypes that combined hardware design with embedded software. At ipXchange, Yunus applies his engineering knowledge and creative approach to produce technical content and product evaluations.
Cooling has seen far less innovation than the rest of the electronics stack. While compute performance continues to increase, most systems still rely on fans and heat sinks. The AirJet Mini G2 introduces a solid-state alternative that engineers can now evaluate.
The AirJet Mini G2 is an active cooling chip that replaces traditional fan-based solutions. It uses a vibrating membrane at ultrasonic frequency to generate a high-speed, unidirectional airflow. This airflow is directed onto a heat spreader using jet impingement, improving heat removal efficiency while remaining silent to human hearing.
A key advantage is pressure performance. Where small fans typically generate 150 to 200 pascals of back pressure, the AirJet Mini G2 reaches around 1,750 pascals. This allows it to maintain airflow in compact systems with tight internal gaps where traditional fans struggle.
In practice, this enables much thinner designs without sacrificing performance. In the demo shown, a mini PC using AirJet cooling achieves similar or better sustained performance while being significantly thinner than a conventional system.
The device also supports filtered airflow, enabling more robust designs for dusty or industrial environments.
For engineers interested in testing the technology, the Snow Goose development kit provides modules and drive electronics for evaluation.
For compact, high-performance systems, this represents a new approach to thermal design worth considering.
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