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Published
9 April 2026
Written by Yunus Unal Mechatronics Engineer and Content Specialist
Yunus is a mechatronics engineer with a background in 5G mobile communications and intelligent embedded systems. Before joining TKO and ipXchange, he developed and tested IoT and control-system prototypes that combined hardware design with embedded software. At ipXchange, Yunus applies his engineering knowledge and creative approach to produce technical content and product evaluations.
At Embedded World 2026, Biwin showed the full journey behind its embedded storage solutions.
The company explained how its products begin at the wafer level and move through advanced IC packaging to final memory and storage products. That vertical approach helps Biwin bring products to market faster and serve a wide range of applications.
The booth featured storage for industrial, automotive, and smart device markets. Highlights included the ultra-thin ePOP5X for wearables, the TAU208 UFS 3.1 for automotive systems, and Biwin’s compact Mini SSD.
The Mini SSD stood out as one of the most interesting products on display. Biwin described it as a full PCIe NVMe SSD in an extremely small form factor, built for next-generation devices that need fast, high-capacity storage in less space. That makes it a strong fit for handheld and compact embedded designs.
The message from Biwin was simple: modern devices need storage that is small, fast, and reliable, and Biwin wants to deliver that across the full product chain.
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