Future Electronics + ams OSRAM Theia 3D Face Recognition Reference Design

Future Electronics and ams OSRAM have collaborated to produce Theia, a continuation of ams OSRAM’s Athena 3D face authentication reference design. Theia comprises ams OSRAM’s Cyclops1-0 3D sensor board and iWave Systems’ Single Board Computer (SBC), which feature NXP Semiconductors’ i.MX 8M Mini system-on-module (SoM).

The Theia reference design quickly (<380 ms) authenticates registered users at distances between 0.5 m and 1.35 m in front of the module. This enables biometric authentication functions for many indoor or outdoor consumer applications, including smart locks, smart access control equipment, and home automation. To aid in evaluation, Theia contains an electronic circuit to drive an e-lock if desired.

Key features of the main modules within Theia are described below.

ams OSRAM Cyclops1-0 3D sensor board

  • MIRA130 – a 1.3 Mpixel global shutter CMOS image sensor with near infrared-enhanced performance
  • Belago 1.1 – a dot-pattern infrared illuminator for 3D stereoscopic imaging or 3D structured light system
  • PMSILplus flood illuminator
  • AS3648 – a 2A LED Flash driver

iWave Systems SBC

  • NXP i.MX 8M Mini Quad: 4 x Arm Cortex-A53 cores, 1 x Cortex-M4 core, graphics processing unit and video processing unit
  • Multi-OS platform support
  • 10-year longevity guarantee
  • IEEE 802.11a/b/g/n/ac Wi-Fi and Bluetooth 5.0
  • 1000/100/10 Mbps Ethernet

Further information regarding Theia is available on request. If you require 3D face recognition for a commercial application, apply to test this technology using the form below.

Note: This kit measures approximately 90 x 150 x 60 mm without the antenna socket and tripod. The connected antenna L shape measures approximately 40 x 120 mm.

Apply for this board


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