Exascend’s AS500 series of BGA SSDs ensure the most robust mounting of high-reliability, fast-access storage in environments prone to shock and vibration. Though the AS500 series is automotive qualified to meet AEC-Q100 Grade 2 standards, it is also a great fit for mission critical, aerospace, transportation, industrial, edge computing, and IoT applications.
The AS500 series features on-device memory controllers and between 128 GB and 1 TB 3D TLC NAND flash memory, accessed through a PCIe 4.0 or NVMe 1.4 interface. These chips support up to four virtual machines and are capable of sequential operations at up to 5 GB/s or random read/write operations at up to 380000 IOPS (Input/Output Operations Per Second).
Exascend has also optimised the AS500 BGA SSDs for size and efficiency, with an ultra-compact 16 x 20-mm form factor and an active power consumption of <3.5 W; for idle operation, this is reduced to <1 W. The devices also feature a DRAM-less design thanks to a Host Memory Buffer (HMB) that enables the use of external DRAM resources as cache memory.
The AS500 series devices also feature a proprietary Adaptive Thermal Control algorithm as part of the internal firmware to ensure peak performance across the complete -40°C to 105°C operating temperature range. In addition to this, the firmware provides power loss protection, wear levelling, and advanced error correction to ensure data integrity is maintained throughout the operating lifetime.
Exascend specifies the Mean Time Between Failures (MTBF) of these devices at 2 million hours and offers a 3-year warranty on its technology.
The AS500 memory can be evaluated using M.2 1620 boards that Exascend provides for easy integration and testing. When it comes to direct PCB soldering of these chips for your production cycle, Exascend will help you to ensure the best performance of its devices in the field.
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